UD Seal


Continuous health monitoring


Research Areas

  • Biosignal Processing
  • Additive Manufacturing
  • Electronic Materials
  • RF Communication

Continuous health monitoring could have significant health benefits for an aging population in addition to its potential for reducing medical costs as a result of shorter hospital stays. A sustainable health monitoring system must be robust, accurate, cost and energy efficient as well as have a minimal impact on the mobility of the user. One attractive new technology for this application is the use of e‐textiles. E‐textiles combine woven or embroidered conductive yarns with printable and embedded sensors and electronics resulting in a wearable garment that can sense and wireless communicate various biosignals within a health monitoring network.


To develop new e‐textile technologies that can be used as part of an integrated health monitoring system. The project is to investigate new materials and fabrication processes for realizing e‐textiles that integrate biosensing, signal conditioning and wireless communication within wearable fabrics. Team members will; (1) explore new electronic materials that are well suited for additive manufacturing technologies such as screen printing, inkjet printing or micro‐dispensing for creating wearable electronic sensors and circuitry, (2) explore novel methods for creating conductive networks within a fabric using custom woven fabrics or computer based embroidery, (3) explore packaging methods for embedding integrated circuitry within a fabric, (4) explore methods of power generation, (5) explore the design and fabricated of integrated wireless communication components such as textile based antennas, (6) develop test and validation procedures.


Additive manufacturing, electronic materials, RF communications, biosignal processing, electronic design, embedded computing, electronic packaging and embedded power systems.


Electronic material design such as functional inks for realizing conductive, resistive and capacitive elements using additive manufacturing; Electronic design of integrated textile based biosensors; Seamless integration of electronic components such as integrated circuits within a textile; Novel methods for power generation; Design of integrated RF components and communication protocols for wireless communication of multiple biosignals.

ADVISOR: Mark Mirotznik (ECE)
MAJORS, PREPARATION, INTERESTS: EE, CE and BME – Electronic material design, biosensing, additive manufacturing of electronic components, RF component design, testing and validation EE, CE and CS – Embedded computing and wireless communication